GJ

G.C.A.M. Janssen

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163 records found

Authored

Isothermal stress relaxation in Al, AlCu and AlVPd films
Conference paper (1996) - JP Lokker, JF Jongste, G.C.A.M. Janssen, S Radelaar

Report on etching of a stack consisting of an aluminum alloy, WGe barrier and Ti adhesion layer. Anisotropy, selectivity to oxide and quality of the adhesion.

Baseline of the High Density Plasma Deposition tool asessed in SiO2 deposition

Aluminium Sub-micron Via-Fill using a high Pressure Liquid Transducer

Deposition
Book chapter (1996) - G.C.A.M. Janssen, O Demolliens

Evaluation of electrical properties of CVD-WGex barriers fabricated by the reduction of WF6 and GeH4

Stress-voiding and Relaxation in single level thermally aged Al Alloys

Copper for IC-applications. Mechanical reliability of CVD copper films

Recommendations for a contact filling process suitable for 0.25 micrometer technologies
Report (1996) - G.C.A.M. Janssen

Recommendations for an aluminium alloy suitable for 0.25 micrometer technologies in terms of electromigration and stress migration
Report (1996) - G.C.A.M. Janssen

First evaluation of new process steps with 0.25 micrometer design rules
Report (1996) - ? Lerme, Y Gobil, G.C.A.M. Janssen

Isothermal stress relaxation in Al, AlCu and AlVPd films
Conference paper (1996) - JP Lokker, JF Jongste, G.C.A.M. Janssen, S Radelaar

The kinetics of tungsten deposition from a H2/WF6 mixture studied by in situ laser Raman scattering
Conference paper (1996) - TGM Oosterlaken, GJ Leusink, G.C.A.M. Janssen, S Radelaar

Electrical properties of WGex contacts on Ti adhesion layers

Modeling of blanket and selective tungsten LPCVD

Anomalous behaviour of stress in AlCu alloys

Report on electromigration- and stress migration properties of AlSi VPd alloys

The kinetics of tungsten deposition from the H2/WF6 mixture studied by in situ laser Raman scattering
Conference paper (1996) - TGM Oosterlaken, GJ Leusink, G.C.A.M. Janssen, S Radelaar

The hydrogen reduction of WF6: A kinetic study based on in situ partial pressure measurements

Interim recommendations for a diffusion barrier process suitable for 0.25 micrometer technologies
Report (1996) - G.C.A.M. Janssen