Our aim is to develop a smart neural interface with transparent electrodes to allow for electrical monitoring of the site of interest during optogenetic stimulation of the spinal cord. In this work, we present the microfabrication process for the wafer-level development of such a compact, active, transparent and flexible implant. The transparent, passive array of electrodes and tracks have been developed using graphene, on top of which chips have been bonded using flip-chip bonding techniques. To provide high flexibility, soft encapsulation, using polydimethylsiloxane (PDMS) has been used. Preliminary measurements after the bonding process have shown resistance values in the range of kΩ for the combined tracks and ball-bonds. @en