In this work, a highly linear temperature sensor based on a silicon carbide (SiC) p-n diode is presented. Under a constant current biasing, the diode has an excellent linear response to the temperature (from room temperature to 600°C). The best linearity (coefficient of determination ${R}^{{2}}$ = 99.98%) is achieved when the current density is 0.53 mA/cm2. The maximum sensitivity of the p-n diode is 3.04 mV/°C. The temperature sensor is fully compatible with Fraunhofer Institute (FHG) IISB's open SiC CMOS (complementary metal-oxide-semiconductor) technology, thus enabling the monolithic integration with SiC readout circuits for high-temperature applications. The sensor also features a simple fabrication process. To our knowledge, the presented device is the first SiC diode temperature sensor that does not require a mesa etch or backside contacts.

The next generation of satellites will need to tackle tomorrow's challenges for communication, navigation and observation. In order to do so, it is expected that the amount of satellites in orbit will keep increasing, form smart constellations and miniaturize individual satellites to make access to space cost effective. To enable this next generation of activities in space, it is vital to ensure the ability of these satellites to properly navigate themselves. This control starts with attitude measurement by the dedicated sensors on the satellite, commonly performed by sun position sensors. The state-of-the art is confronted by large signal distortions caused by light reflected by the Earth's albedo as well as keeping up with the satellite miniaturization trend. This work aims to address both these issues, by presenting a microfabricated albedo insensitive sun position sensor in silicon carbide with wafer-level integrated optics. The presented 10 mm×10 mm×1 mm system reaches a mean angular accuracy of 5.7° in a ±37° field-of-view and integrates an on-chip temperature sensor with a -3.9 mV K⁻¹ sensitivity in the 20 °C to 200 °C range.

This work presents the design and characterization of an analog-to-digital converter (ADC) with silicon carbide (SiC) for sensing applications in harsh environments. The SiC-based ADC is implemented with the state-of-the-art low-voltage SiC complementary-metal-oxide-semiconductor (CMOS) technology developed by Fraunhofer IISB. Two types of ADCs, i.e., a 4-bit flash ADC and a 6-bit successive-approximation (SAR) ADC, are designed and simulated up to 300 degrees Celsius. The measurement results show that the 4-bit SiC flash ADC can operate reliably up to at least 200 degrees Celsius, which outperforms the Si counterpart regarding the maximum operating temperature.

An angle sensitive optical sensor without conventional optics is presented in this article. The reported device omits the need for adding 3-D optics in postprocessing by monolithic integration of complimentary metal-oxide semiconductor compatible diffraction grating layers, which cuts down the fabrication costs and allows for miniaturization of these types of sensors. The sensor resolves angular information from a monochromatic light source over a single axis with a mean absolute accuracy of 0.6° in an investigated $\pm 26$° field-of-view using four unique pixels. This letter facilitates miniaturization of light source trackers, such as sun position sensors on small satellites of the future.

The wide bandgap of silicon carbide (SiC) has attracted a large interest over the past years in many research fields, such as power electronics, high operation temperature circuits, harsh environmental sensing, and more. To facilitate research on complex integrated SiC circuits, ensure reproducibility, and cut down cost, the availability of a low-voltage SiC technology for integrated circuits is of paramount importance. Here, we report on a scalable and open state-of-the-art SiC CMOS technology that addresses this need. An overview of technology parameters, including MOSFET threshold voltage, subthreshold slope, slope factor, and process transconductance, is reported. Conventional integrated digital and analog circuits, ranging from inverters to a 2-bit analog-to-digital converter, are reported. First yield predictions for both analog and digital circuits show great potential for increasing the amount of integrated devices in future applications.

In this paper we present, for the first time, the successful monolithic wafer-scale integration of CVD graphene with CMOS logic for highly miniaturized smart sensing structures with on-chip readout electronics. The use of a patterned CMOS compatible catalyst for pre-defined regions of CVD graphene growth, and the transfer-free process used, allows the direct implementation of patterned graphene structures between the front-end-of-line (FEOL) and back-end-of-line (BEOL) processes. No significant deterioration of the graphene properties and of the CMOS logic gate performance due to the high temperature graphene growth step was observed. This is a significant leap towards industrial production of graphene-based smart MEMS/NEMS sensors.