XZ

Xiao Liang Zeng

2 records found

Authored

Hexagonal boron nitride (BN) is often used as filler to improve the thermal conductivity of polymer matrix due to its high thermal conductivity. However, previously reported BN-based composites always have a high in-plane thermal conductivity, which is not beneficial for verti ...

With the miniaturization of electronic devices and the development of integrated circuit chips in higher density and higher frequencies, thermal management has become one of the most critical challenges in device performance and reliability. Thermal interface material is bonded b ...