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Qipeng

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Nano-metal sintering is a promising technology for the next generation of semiconductor packaging due to its positive effect on reliability enhancement. Compared with the silver sintering, copper-based sintering technique has more potential to be applied in die attachment field a ...

IGBT device is developed from silicon to wide bandgap semiconductor materials, and its working temperature has reached to 300 °C, so the encapsulation is particularly important. NanoCu paste is investigated under H2 at 300°C. A chip is linked to DBC substrate by nanoCu paste u ...