Outgassing of Materials Used for Thin Film Vacuum Packages

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Outgassing of Materials Used for Thin Film Vacuum Packages

Conference Paper (2009)

Author(s)

Q Li (TU Delft - Computational Design and Mechanics)

Johannes Goosen (TU Delft - Computational Design and Mechanics)

JTM van Beek (External organisation)

A. Keulen (TU Delft - Computational Design and Mechanics)

GQ Zhang (External organisation)

Research Group

Computational Design and Mechanics

Conf.proc. > 3 pag Conference contrib. refereed

To reference this document use:

https://resolver.tudelft.nl/uuid:59688834-8974-43f6-afc1-4dea2bab599c

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Publication Year

2009

Research Group

Computational Design and Mechanics

Pages (from-to)

802-806

ISBN (print)

978-1-4244-4659-9

Abstract

In this paper, outgassing of the thin film vacuum package is analyzed by integrated MEMS (Microelectromechanical system) resonator and RBS (Rutherford backscattering spectroscopy). Outgassing behavior of different thin film packaging materials is studied by exodiffusion experiments. It is demonstrated that a high temperature pre anneal will greatly reduce the outgassing but can not eliminate it.

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