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1 The Role of Molding Compound Microstructure for Packaging Reliability
article 2015    
Author: Fischer, H.R. · Nabi, H.S. · Weiss, L. · Gielen, A.W.J.
Keywords: Packaging Electronics · Molding compound · Multi-scale modelling · Microstructure · Packaging reliability · Industrial Innovation · Nano Technology · MAS - Materials Solutions · TS - Technical Sciences
[Abstract]

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