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Showing 1 to 9 of 9 found. | Sort by date

1 Laser-assisted Wafer Processing : New Perspectives in Through-Substrate Via Drilling and Redistribution Layer Deposition
bookPart 2014    
Author: Hoppenbrouwers, M.B. · Oosterhuis, G. · Knippels, G. · Roozeboom, F.
Keywords: Physics · TSV drilling and filling · Laser assisted · Wafer level packaging and 3-D integration · Industrial Innovation · Mechanics, Materials and Structures · TFT - Thin Film Technology · TS - Technical Sciences

2 Laser induced forward transfer of interconnects for 3D integration
article 2011    
Author: Oosterhuis, G. · Prenen, A. · Huis in 't veld, A.J.
Keywords: Electronics · Industrial Innovation · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing HOL - Holst · TS - Technical Sciences
[Abstract]

3 2D and 3D interconnect fabrication by picosecond Laser Induced Forward Transfer
article 2011    
Author: Oosterhuis, G. · Huis in 't veld, A.J. · Chall, P.
Keywords: Physics · Chip packaging · Silicon wafers · Three dimensional integrated circuits · Deposition process · Laser induced forward transfer · LIFT · Picosecond laser · Through silicon vias · TSV · Industrial Innovation · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing · TS - Technical Sciences
[Abstract]

4 Fully additive chip packaging: science or fiction?
article 2011    
Author: Oosterhuis, G. · Zon, C.M.B. van der · Maalderink, H.H.
Keywords: Electronics · additive manufacturing · 3D printing · interconnects · packaging · 3D stacking · conductors · More than Moore · Industrial Innovation · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing · TS - Technical Sciences
[Abstract]

5 Micron-scale copper wires printed using femtosecond laser-induced forward transfer with automated donor replenishment
article 2013    
Author: Grant-Jacob, J.A. · Mills, B. · Feinaeugle, M. · Sones, C.L. · Oosterhuis, G. · Hoppenbrouwers, M.B. · Eason, R.W.
Keywords: Materials · Ultrafast lasers · Microstructure fabrication · Nanostructure fabrication · Optical fabrication · Laser materials processing · High Tech Systems & Materials · Industrial Innovation · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing HOL - Holst · TS - Technical Sciences
[Abstract]

6 Novel approaches for low-cost through-silicon vias
article 2011    
Author: Bullema, J.E. · Bressers, P. · Oosterhuis, G. · Mueller, M. · Huis in 't veld, A.J. · Roozeboom, F.
Keywords: Electronics · deep reactive ion etching · laser induced forward transfer · electrochemical machining · 3D stacking · Cost of ownership · Creation process · Deep Reactive Ion Etching · Electrochemical machining · Functional integration; High costs · Laser drilling · Laser Induced Forward Transfer · Packaging technologies · Processing time · Pulse reverse plating · Through silicon vias · Through-Silicon-Via · Industrial Innovation · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing TFT - Thin Film Technology · TS - Technical Sciences
[Abstract]

7 Robust process windows for laser induced forward transfer of thin film metal to create interconnects
article 2012    
Author: Oosterhuis, G. · Giesbers, M.P. · Melick, P.A.J. van · Hoppenbrouwers, M.B. · Prenen, A.M. · Huis in ‘t Veld, A.J. · Knippels, G.
Keywords: Physics · Industrial Innovation · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing · TS - Technical Sciences
[PDF] [Abstract]

8 Tuneable adhesion through novel binder technologies
article 2011    
Author: Wouters, M.E.L. · Burghoorn, M.M.A. · Ingenhut, B. · Timmer, K. · Rentrop, C.H.A. · Bots, T.L. · Oosterhuis, G. · Fischer, H.R.
Keywords: Chemistry · Adhesive · Coating · Debond on command · Rheology · Thermoreversible crosslinking · Fluid Mechanics Chemistry & Energetics · RMC - Responsive Materials & Coating · TS - Technical Sciences
[Abstract]

9 Additive interconnect fabrication by picosecond Laser Induced Forward Transfer
article 2010    
Author: Oosterhuis, G. · Veld, B.H. in 't · Ebberink, G. · Del Cerro, D.A. · Eijnden, E. van den · Chall, P. · Zon, B. van der
Keywords: Electronics · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing · TS - Technical Sciences
[Abstract]

Search results also available in MS Excel format.

Showing 1 to 9 of 9 found. | Sort by date