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Showing 1 to 8 of 8 found. | Sort by date

1 Gas and vapour detection using polypyrrole
article 1999    
Author: Leur, R.H.M. van de · Waal, A. van der
Keywords: Traffic · Chemical sensors · Composition effects · Electric conductivity · Electrochemistry · Organic solvents · Synthesis (chemical) · Temperature · Vapors · Butanon · Vapor detection · Polypyrroles
[Abstract]

2 Novel reliability assessment concept based on an accelerated de-rated strength approach
article 2013    
Author: Veninga, E.P. · Kregting, R. · Waal, A. van der · Gielen, A.W.J.
Keywords: Electronics · High Tech Systems & Materials · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

3 Bonding bare die LEDs on PET foils for lighting applications: Thermal design modeling and bonding experiments
article 2012    
Author: Ende, D.A. van den · Kusters, R.H.L. · Cauwe, M. · Waal, A. van der · Brand, J. van den
Keywords: Physics Vision · Infrared imaging · Integration · Lighting · LED · Flexible foil substrates · Infrared thermal imaging · Lighting applications · Low-temperature stability · Manufacturing process · Maximum temperature · Thermal design models · Light emitting diodes · Industrial Innovation · Mechatronics, Mechanics & Materials · HOL - Holst MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

4 Thermo-mechanical model optimization of HB-LED packaging
article 2011    
Author: Yuan, C.A. · Erinc, M. · Gielen, A.W.J. · Waal, A. van der · Driel, W. van · Zhang, K.
Keywords: Materials · High brightness LED (HB-LED) · Packaging reliability · Wafer level HB-LED · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

5 High speed bending of 2nd level interconnects on printed circuit boards for automotive electronics
article 2011    
Author: Kouters, M.H.M. · Ubachs, R. · Wiel, H.J. van de · Waal, A. van der · Veer, J. van der
Keywords: Electronics · 2nd level interconnect · bending · FE modeling · mechanical · PCB · vibration · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

6 Large area flexible lighting foils using distributed bare LED dies on polyester substrates
article 2013    
Author: Ende, D.A. van den · Kusters, R.H.L. · Cauwe, M. · Waal, A. van der · Brand, J. van den
Keywords: Vision · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

7 Residual stress in silicon caused by Cu-Sn wafer-level packaging
article 2013    
Author: Taklo, M.M.V. · Vardøy, A.S. · Wolf, I. de · Simons, V. · Wiel, H.J. van de · Waal, A. van der · Lapadatu, A. · Martinsen, S. · Wunderle, B.
Keywords: Packaging · Residual stress · Silicon · Cu-Sn · Wafer level packaging · Industrial Innovation · Mechatronics, Mechanics & Materials · MPC - Materials Performance Centre · TS - Technical Sciences
[Abstract]

8 Systematic characterization of key parameters of hermetic wafer-level Cu-Sn SLID bonding
article 2013    
Author: Wiel, H.J. van de · Vardøy, A.S.B. · Hayes, G. · Kouters, M.H.M. · Waal, A. van der · Erinc, M. · Lapadatu, A. · Martinsen, S. · Taklo, M.M.V. · Fischer, H.R.
Keywords: Chemistry Materials · Cu-Sn · Hermetic · Packaging · Reliability · Solid-Liquid Inter-Diffusion · Wafer-level · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

Search results also available in MS Excel format.

Showing 1 to 8 of 8 found. | Sort by date