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1 Novel methodology to integrate ultra-thin chips on flexible foils
article 2012    
Author: Sridhar, A. · Cauwe, M. · Kusters, R.H.L. · Fledderus, H. · Brand, J. van den
Keywords: Electronics · UTC · Ultra thin chips · Polymer foil · Thermal stability · Industrial Innovation · Mechatronics, Mechanics & Materials · HOL - Holst · TS - Technical Sciences
[Abstract]

2 Bonding bare die LEDs on PET foils for lighting applications: Thermal design modeling and bonding experiments
article 2012    
Author: Ende, D.A. van den · Kusters, R.H.L. · Cauwe, M. · Waal, A. van der · Brand, J. van den
Keywords: Physics Vision · Infrared imaging · Integration · Lighting · LED · Flexible foil substrates · Infrared thermal imaging · Lighting applications · Low-temperature stability · Manufacturing process · Maximum temperature · Thermal design models · Light emitting diodes · Industrial Innovation · Mechatronics, Mechanics & Materials · HOL - Holst MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

3 Capillary self-alignment dynamics for R2R manufacturing of mesoscopic system-in-foil devices
article 2012    
Author: Arutinov, G. · Quintero, A.V. · Smits, E.C.P. · Remoortere, B. van · Brand, J. van den · Schoo, H.F.M. · Briand, D. · Rooij, N.F. de · Dietzel, A.H.
Keywords: Electronics · Adhesive joints · Electronics engineering · Integration · Sensors · Web foil · Dies · Electrical interconnections · Flexible polymeric substrates · Self-alignment process · Industrial Innovation · Mechatronics, Mechanics & Materials · HOL - Holst · TS - Technical Sciences
[Abstract]

4 Performance of inkjet-printed structures on different substrate materials under high humidity and elevated temperature conditions
article 2012    
Author: Palacios-Aguilera, N.B. · Visser, H.A. · Vargas-Llona, L.D. · Balda-Irurzun, U. · Sridhar, A. · Akkerman, R. · Bossche, A.
Keywords: Science Electronics · Adhesion · Electronics engineering · Reliability · Different substrates · Elevated temperature · Enabling technologies · High temperature condition · Moisture resistance · Printed electronics · Substrates · Inkjet printing · Industrial Innovation · Mechatronics, Mechanics & Materials · HOL - Holst · TS - Technical Sciences
[Abstract]

5 Additive manufacturing approaches for stress relief in semiconductor die packaging
article 2012    
Author: Zon, C.M.B. van der · Wiel, A. van der · Maalderink, H.H. · Vaes, M.H.E. · Aulbers, A.P. · Vorst, L.T.G. van de · Cate, A.T. ten · Furrer, J.F. · Burssens, J.W. · Chen, J.
Keywords: Packaging · Additive Manufacturing · Packaging stress · Semiconductor chips · Chip scale packages · Industrial Innovation · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing · TS - Technical Sciences
[Abstract]

6 A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
article 2012    
Author: Cauwe, M. · Vandecasteele, B. · Baets, J. de · Brand, J. van den · Kusters, R.H.L. · Sridhar, A.
Keywords: Packaging · Smart labels · Low-cost plastics · Process flows · Smart Packaging · Chip embedding · Industrial Innovation · Mechatronics, Mechanics & Materials · HOL - Holst · TS - Technical Sciences
[Abstract]

7 Combination of Bayesian networks and FEM models to predict reliability of LED systems
article 2012    
Author: Bullema, J.E. · Werkhoven, R.J. · Gielen, A.W.J. · Kunen, J.M.G. · Hesen, P. · Swartjes, F.H.M. · Boschman, F.
Keywords: Vision · Bayesian networks · Electronics engineering · LED lighting system · LED luminaries · LED packaging · Reliability engineering · Light emitting diodes · Industrial Innovation · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing · TS - Technical Sciences
[Abstract]

8 Characterization of hermetic wafer-level Cu-Sn SLID bonding
article 2012    
Author: Wiel, H.J. van de · Vardøy, A.S.B. · Hayes, G. · Fischer, H.R. · Lapadatu, A. · Taklo, M.M.V.
Keywords: Electronics Packaging · SLID · Copper compounds · Cu-Sn · Electronics engineering · Bond interface · Bonding process · Room temperature · Solid liquid inter diffusion · Vacuum sealing · Wafer bonding · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

9 Solving the technology barriers in flexible AMOLED displays
article 2014    
Author: Gelinck, G.H. · Steen, J.L. van der · Tripathi, A.K. · Ellis, T. · Akkerman, H. · Leuken, L. van · Li, F. · Maas, J. · Smits, E. · Rovers, M. · Nag, M. · Myny, K. · Malinowski, P. · Ameys, M. · Ke, T.H. · Schols, S. · Steudel, S. · Genoe, J. · Heremans, P.
Keywords: Science · Flat panel displays · Flexible displays · Thin film transistors · Driving method · Flexible plastics · High resolution · OLED displays · Process temperature · Self-aligned · Technology barriers · Technology challenges · Organic light emitting diodes (OLED) · Industrial Innovation · Mechanics, Materials and Structures · HOL - Holst · TS - Technical Sciences
[Abstract]

10 Characterization of intermetallic compounds in Cu-Al ball bonds: thermo-mechanical properties, interface delamination and corrosion
article 2012    
Author: Gubbels, G.H.M. · Kouters, M.H.M. · Dos Santos Ferreira, O.
Keywords: Electronics Chemistry · Aluminum · Automobile electronic equipment · Chemical industry · Copper Electronics engineering · Corrosion and oxidation · Copper compounds · Industrial Innovation · Mechatronics, Mechanics & Materials · TFT - Thin Film Technology · TS - Technical Sciences
[Abstract]

11 First measurements on a novel type of optical micro-machined ultrasound transducer (OMUT)
article 2014    
Author: Leinders, S.M. · Dongen, K.W.A. van · Jong, N. de · Verweij, M.D. · Westerveld, W.J. · Urbach, H.P. · Neer, P.L.M.J. van · Pozo Torres, J.M.
Keywords: Electronics · High Tech Systems & Materials · Industrial Innovation · Fluid Mechanics Chemistry & Energetics Physics & Electronics · PID - Process & Instrument Development OPT - Optics · TS - Technical Sciences
[Abstract]

12 Flexible and stretchable electronics for wearable healthcare
article 2014    
Author: Brand, J. van den · Kok, M. de · Sridhar, A. · Cauwe, M. · Verplancke, R. · Bossuyt, F. · Baets, J. de · Vanfleteren, J.
Keywords: Electronics Health · Flexible electronics · Stretchable electronics · Human bodies · Human health · Industrial Innovation · Mechanics, Materials and Structures · HOL - Holst · TS - Technical Sciences
[Abstract]

13 Ultrasound transmission spectroscopy: in-line sizing of nanoparticles
article 2014    
Author: Neer, P.L.M.J. van · Volker, A.W.F. · Pierre, G. · Bouvet, F. · Crozat, S.
Keywords: Electronics · Nanoparticle sizing · Transmission spectroscopy · Ultrasound spectroscopy · High Tech Systems & Materials · Industrial Innovation · Fluid Mechanics Chemistry & Energetics · PID - Process & Instrument Development · TS - Technical Sciences
[Abstract]

14 Performance of relay-enabled uplink in cellular networks - A flow level analysis
article 2009    
Author: Dimitrova, D.C. · Heijenk, G. · Berg, J.L. van den
Keywords: Informatics
[PDF] [Abstract]

15 Touch-based Brain Computer Interfaces: State of the art
article 2014    
Author: Erp, J.B.F. van · Brouwer, A.M.
Keywords: Perception · BCI · BMI · Brain Computer Interface · Brain Machine Interface · P300 · SSSEP · Tactile · Touch · Handicapped persons · Haptics · Brain computer interface · Human Performances · PCS - Perceptual and Cognitive Systems · ELSS - Earth, Life and Social Sciences
[Abstract]

16 In-situ measurements of material thermal parameters for accurate LED lamp thermal modelling
article 2013    
Author: Vellvehi, M. · Perpina, X. · Jorda, X. · Werkhoven, R.J. · Kunen, J.M.G. · Jakovenko, J. · Bancken, P. · Bolt, P.J.
Keywords: Vision · Computer simulation · Light emitting diodes · Thermocouples · Air exchanges · In-situ measurement · LEd lamps · Specific location · Thermal modelling · Thermal parameters · Thermal conductivity · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products TFT - Thin Film Technology · TS - Technical Sciences
[Abstract]

17 The perception of visual uncertainty representation by non-experts
article 2014    
Author: Tak, S. · Toet, A. · Erp, J. van
Keywords: Perception · non-expert audiences · spatial data · Uncertainty visualization · user study · Human Performances · PCS - Perceptual and Cognitive Systems · ELSS - Earth, Life and Social Sciences
[Abstract]

18 Characterization of optical strain sensors based on silicon waveguides
article 2013    
Author: Westerveld, W.J. · Pozo Torres, J.M. · Muilwijk, P.M. · Leinders, S.M. · Harmsma, P.J. · Tabak, E. · Dool, T.C. van den · Dongen, K.W.A. van · Yousefi, M. · Urbach, H.P.
Keywords: Electronics · High Tech Systems & Materials · Industrial Innovation · Physics & Electronics Mechatronics, Mechanics & Materials · OPT - Optics NI - Nano Instrumentation OM - Opto-Mechatronics · TS - Technical Sciences
[Abstract]

19 Exploiting multiple mahalanobis distance metrics to screen outliers from analog product manufacturing test responses
article 2013    
Author: Krishnan, S. · Kerkhoff, H.G.
Keywords: Biology · Biomedical Innovation · Healthy Living · Life · RAPID - Risk Assessment Products in Development · ELSS - Earth, Life and Social Sciences
[Abstract]

20 Structural vulnerability assessment of electric power grids
article 2014    
Author: Koç, Y. · Warnier, M. · Kooij, R.E. · Brazier, F.
Keywords: Telecommunication · Electric fault currents · Electric power distribution · Electric properties · Cascading failures · Critical component · Electric power grids · Grid topology · Structural vulnerability assessments · Topological metrics · Vulnerability analysis · Topology · Infrastructures · Information Society · Communication & Information · PNS - Performance of Networks & Services · TS - Technical Sciences
[Abstract]

Search results also available in MS Excel format.

Showing 1 to 20 of 70 found. Next | Sort by date