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1 Electrodeposition of Zn-Co and Zn-Co-Fe alloys from acidic chloride electrolytes
article 2007    
Author: Lodhi, Z.F. · Mol, J.M.C. · Hovestad, A. · Terryn, H. · Wit, J.H.W. de
Keywords: Anomalous codepositions · Electroplating parameters · ZnCoFe alloys · Cathodic polarization · Cobalt alloys · Current density · Iron alloys · Zinc alloys · Acidic chloride electrolytes · Transition current density · Electroplating
[Abstract]

2 Electroplating of electrical circuitry on optoelectronic windows for thin film solar cells on foil
article 2010    
Author: Hovestad, A. · Rendering, H. · Peter, M. · Meinders, E.R.
Keywords: Materials · Photovoltaic’s · TCO's · Grids, · Electroplating · Industrial Innovation · Mechatronics, Mechanics & Materials · TFT - Thin Film Technology HOL - Holst · TS - Technical Sciences
[Abstract]

3 Interfacial fatigue stress in PVD TiN coated tool steels under rolling contact fatigue conditions
article 1998    
Author: Carvalho, N.J.M. · Huis in 't Veld, A.J. · Hosson, J.T. de
Keywords: Materials · Interfacial fatigue stress · Monolayers · Physical vapour deposition · Rolling contact fatigue · TiN coatings · Crack propagation · Electroplating · Fatigue of materials · Hardness · Interfaces (materials) · Plasma applications · Stresses · Surface roughness · Titanium nitride · Tool steel · Vapor deposition · Triode ion plating · Protective coatings
[Abstract]

4 Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride or PE-ALD titanium nitride for void-free bottom-up copper electroplating
article 2011    
Author: Saadaoui, M. · Zeijl, H. van · Wien, W.H.A. · Pham, H.T.M. · Kwakernaak, C. · Knoops, H.C.M. · Erwin Kessels, W.M.M. · Sanden, R.M.C.M. van de · Voogt, F.C. · Roozeboom, F. · Sarro, P.M.
Keywords: Bottom-up copper electroplating · Si interposer · superhydrophilic wetting · system-in-package · through-silicon vias · wafer level packaging and 3-D integration · Industrial Innovation · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing · TS - Technical Sciences
[Abstract]

5 Measurement of Seebeck coefficient of electroplated thermoelectric films in presence of a seed layer
article 2011    
Author: Nguyen, H.P. · Su, J. · Wang, Z. · Vullers, R.J.M. · Vereecken, P.M. · Fransaer, J.
Keywords: Electrodeposition · Thermally stimulated current · Thermoelectric · Bulk resistance · Electroplated films · Finite element simulations · Seebeck coefficient measurement · Seed layer · Thermally stimulated current · Thermoelectric · Thermoelectric film · Electrodeposition · Electroplating · Seebeck coefficient · Sheet resistance · Finite element method · Infrastructures · Information Society · Mechatronics, Mechanics & Materials · HOL - Holst · TS - Technical Sciences
[Abstract]

Search results also available in MS Excel format.

Showing 1 to 5 of 5 found. | Sort by date