Repository hosted by TU Delft Library

Home · Contact · About · Disclaimer ·
 

Search results also available in MS Excel format.

Showing 1 to 14 of 14 found. | Sort by date

1 Power-aware architecting for data-dominated applications
book 2007    
Author: Ditzel, M. · Otten, R.H.J.M. · Serdijn, W.A.
Keywords: Electronics · Circuits and systems · Electrical Engineering · Engineering Design · Electronics and Microelectronics, Instrumentation · Energy Technology
[Abstract]

2 An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components
article 2015    
Author: Yazdan Mehr, M. · Bahrami, A. · Fischer, H. · Gielen, S. · Corbeij, R. · van Driel, W.D. · Zhang, G.Q.
Keywords: Electronics · Acoustic microscopes · Microelectronics; Microsystems · Nondestructive examination · High Tech Systems & Materials · Industrial Innovation · Nano Technology · MAS - Materials Solutions · TS - Technical Sciences
[Abstract]

3 Organic transistors in optical displays and microelectronic applications
article 2010    
Author: Gelinck, G.H. · Heremans, P. · Nomoto, K. · Anthopoulos, T.D.
Keywords: Instruments · Active matrixes · Backplanes · Biological sensors · Microelectronic applications · Optical displays · Organic thin film transistors · Organic transistor · Analog circuits · Digital circuits · Electrophoretic displays · Flexible displays · Light emitting diodes · Microelectronics · Thin film transistors · Organic light emitting diodes (OLED)
[Abstract]

4 Prediction of the thermo-mechanical material behavior of PEN foil during photolithographic processing
article 2009    
Author: Barink, M. · Goorhuis, M. · Giesen P. · Furthner, F. · Yakimets, I.
Keywords: Bending behavior · Environmental factors · Flexible substrate · Lithographic process · Lithography process · Loading experiment · Organic materials · Plastic electronics · Thermo-mechanical · Thermomechanical model · Experiments · Lithography · Microelectronics · Microsystems · Plastic products · Simulators · Thermomechanical treatment · Substrates
[Abstract]

5 The electro-thermal-mechanical performance of an OLED : a multi-physics model study
article 2009    
Author: Gielen, A.W.J. · Barink, M. · Brand, J. van de · Mol, A.M.B. van
Keywords: Electronics · Detailed design · Finite Element · Mechanical performance · Model study · Multi-physics · Simulation model · Thermo-mechanical · Three-dimensional model · Two dimensional model · Microelectronics · Microsystems · Organic light emitting diodes (OLED) · Three dimensional · Simulators
[Abstract]

6 Understanding the transport phenomena leading to tarnishing of the reflecting silver layer causing reduced light output of LEDs
article 2017    
Author: Herrmann, A. · Erich, S.J.F. · Ven, L.G.J.V.D. · Driel, W.D. van · Soestbergen, M. van · Mavinkurve, A. · Buyl, F. de · Adan, O.C.G.
Keywords: Materials · Microelectronics · Microsystems · Silver · Color spectra · Failure mechanism · Light output · Luminous flux · Silver layer · Transport phenomena · Light emitting diodes · High Tech Systems & Materials · Industrial Innovation · Nano Technology · MAS - Materials Solutions · TS - Technical Sciences

7 Comprehensive material characterization and method of its validation by means of FEM simulation
article 2011    
Author: Gromala, P. · Duerr, J. · Dressler, M. · Jansen, K.M.B. · Hawryluk, M. · Vreugd, J. de
Keywords: Bi-material strips · Coefficient of thermal expansion · Copper substrates · Curing shrinkage · FEM simulations · Fringe pattern · Geometrical dimensions · Material characterizations · Material modeling · Material models · Modulus of elasticity · Molding compound · Numerical simulation · Warpages Engineering · Curing · Experiments · Finite element method · Microelectronics · Microsystems · Numerical methods · Product design · Shrinkage Engineering · Thermal expansion · Mechatronics, Mechanics & Materials · OM - Opto-Mechatronics · TS - Technical Sciences
[Abstract]

8 Energy autonomous sensor systems : Towards a ubiquitous sensor technology
article 2010    
Author: Belleville, M. · Fanet, H. · Fiorini, P. · Nicole, P. · Pelgrom, M.J.M. · Piguet, C. · Hahn, R. · Hoof, C. van · Vullers, R. · Tartagni, M. · Cantatore, E.
Keywords: Electronics · Data converters · Energy autonomous systems · Energy harvesting · Energy scavenging · Power converters · Autonomous sensors · Autonomous systems · Battery technology · Data converter · Electronic functions · Electronic systems · Energy budgets · Energy scavenging · Miniaturized electronics · Operational life · Ubiquitous sensor · Ultra-low power · Working groups · Energy efficiency · Harvesting · Microelectronics · Power converters · Sensors · Energy harvesting · High Tech Systems & Materials · Industrial Innovation · Mechatronics, Mechanics & Materials · HOL - Holst · TS - Technical Sciences
[Abstract]

9 Thermo-mechanical challenges in the longevity of micro-electronics
article 2010    
Author: Gielen, A.W.J.
Keywords: Electronics · Accelerated lifetime testing · Acceleration factors · Automotive electronics · Degradation mechanism · Lifetime assessment · Long duration · Mission profile · Operational conditions · Testing conditions · Thermo-mechanical · Automobile parts and equipment · Degradation · Microelectronics · Microsystems · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

10 Modeling the residual shrinkage during lithographic processing on flexible polymer substrates
article 2010    
Author: Barink, M. · Berg, D. van den · Yakimets, I. · Meinders, E.R.
Keywords: Electronics · Accurate prediction · Electronic circuitry · Electronic device · Experimental investigations · Feature sizes · Flexible polymer substrates · Lithographic processing · Modeling approach · Overlay errors · Polymer foil · Production process · Temperature dependent · Visco-elastic material · Deformation · Microelectronics · Microsystems · Polymers · Shrinkage · Substrates · High Tech Systems & Materials · Industrial Innovation · Mechatronics, Mechanics & Materials · HOL - Holst · TS - Technical Sciences
[Abstract]

11 Optical and thermal simulation chain for LED package
article 2016    
Author: Tapaninen, O. · Myohanen, P. · Majanen, M. · Sitomaniemi, A. · Olkkonen, J. · Hildenbrand, V. · Gielen, A.W.J. · Mackenzie, F.V. · Barink, M. · Smilauer, V. · Patzak, B.
Keywords: Vision Electronics · Computer programming · Microelectronics · Microsystems · Open source software · Open systems · Comsol multiphysics · Multi-physics modelling · Open source platforms · Open sources · Optical simulation · Physical aspects · Python programming language · Thermal simulations · Computer software · Industrial Innovation · Nano Technology · MAS - Materials Solutions · TS - Technical Sciences
[Abstract]

12 Overview on thermal and mechanical challenges of high power RF electronic packaging
article 2011    
Author: Yuan, C.A. · Kregting, R. · Driel, W. van · Gielen, A.W.J. · Xiao, A. · Zhang, G.Q.
Keywords: Electronics · Aluminum wires · Ceramic package · Plastic high power packages · RF power packages · Thermal and mechanical modeling · Aluminum wires · Ceramic package · High power package · Mechanical modeling · Rf-power · Electronics packaging · Integrated circuits · Microelectronics · Wireless telecommunication systems · Power electronics · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

13 Atmospheric pressure plasma enhanced spatial ALD of ZrO2 for low-temperature, large-area applications
article 2017    
Author: Mione, M.A. · Katsouras, I. · Creyghton, Y. · Boekel, W. van · Maas, J. · Gelinck, G. · Roozeboom, F. · Illiberi, A.
Keywords: Atmospheric pressure · Atomic layer deposition · Deposition rates · Film growth · Flexible electronics · High-k dielectric · Leakage currents · Microelectronics · Permittivity · Silica · Surface reactions · Zirconia · Atmospheric pressure plasmas · Deposition temperatures · Electronics applications · Film crystallinity · High permittivity · Lower temperatures · Microelectronic applications · Relative permittivity · Atmospheric temperature
[Abstract]

14 Local stress analysis in devices by FIB
article 2010    
Author: Kregting, R. · Gielen, A.W.J. · Driel, W. van · Alkemade, P. · Miro, H. · Kamminga, J.-D.
Keywords: Materials · Bond pad · Digital image correlations · Early failure · FE model · FIB milling · Finite elements · Gold layer · In-plane displacement · Intrinsic stress · Local stress analysis · Nano meter range · Power lines · Scanning electron microscopes · SEM image · Semiconductor structure · Small Hole · Strain gauge · Gages · Gold coatings · Microsystems · Milling (machining) · Plant shutdowns · Scanning electron microscopy · Stress analysis · Microelectronics · High Tech Systems & Materials · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

Search results also available in MS Excel format.

Showing 1 to 14 of 14 found. | Sort by date