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1 The Role of Molding Compound Microstructure for Packaging Reliability
article 2015    
Author: Fischer, H.R. · Nabi, H.S. · Weiss, L. · Gielen, A.W.J.
Keywords: Packaging Electronics · Molding compound · Multi-scale modelling · Microstructure · Packaging reliability · Industrial Innovation · Nano Technology · MAS - Materials Solutions · TS - Technical Sciences
[Abstract]

2 Thermo-mechanical model optimization of HB-LED packaging
article 2011    
Author: Yuan, C.A. · Erinc, M. · Gielen, A.W.J. · Waal, A. van der · Driel, W. van · Zhang, K.
Keywords: Materials · High brightness LED (HB-LED) · Packaging reliability · Wafer level HB-LED · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences
[Abstract]

Search results also available in MS Excel format.

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