Repository hosted by TU Delft Library

Home · Contact · About · Disclaimer ·
 

Search results also available in MS Excel format.

Showing 1 to 4 of 4 found. | Sort by date

1 Hybrid Coupling of Laser Light sources to Silicon (Oxy)Nitride Based Waveguides
article 1997    
Author: Krijger, A.J.T. de · Bekman, H.H.P.T.
Keywords: Integrated optics · Sensor · Diode laser · Glass optical waveguides · Thermocompression · Hybrids · Reactive ion etching
[PDF] [Abstract]

2 A new concept for spatially-divided Reactive Ion Etching with ALD-based passivation
article 2013    
Author: Roozeboom, F. · Kniknie, B. · Lankhorst, A.M. · Winands, G. · Knaapen, R. · Smets, M. · Poodt, P. · Dingemans, G. · Keuning, W. · Kessels, W.M.M.
Keywords: Energy · Ion etching machine · Spatially-divided Deep Reactive Ion Etching · Ald-based passivation · DRIE · Industrial Innovation · Mechatronics, Mechanics & Materials · TFT - Thin Film Technology · TS - Technical Sciences

3 Alternative technology concepts for low-cost and high-speed 2D and 3D interconnect manufacturing
article 2013    
Author: Roozeboom, F. · Smets, M. · Kniknie, B. · Hoppenbrouwers, M. · Dingemans, G. · Keuning, W. · Kessels, W.M.M. · Pohl, R. · Huis In't Veld, A.J.
Keywords: Manufacturing · 3D interconnect · ALD oxide passivation · Laser-Induced Forward Transfer · Redistribution layers · Spatially-divided Deep Reactive Ion Etching · TSV drilling and filling · Atomic layer deposition · Industrial Innovation · Mechatronics, Mechanics & Materials · TFT - Thin Film Technology · TS - Technical Sciences
[Abstract]

4 Novel approaches for low-cost through-silicon vias
article 2011    
Author: Bullema, J.E. · Bressers, P. · Oosterhuis, G. · Mueller, M. · Huis in 't veld, A.J. · Roozeboom, F.
Keywords: Electronics · deep reactive ion etching · laser induced forward transfer · electrochemical machining · 3D stacking · Cost of ownership · Creation process · Deep Reactive Ion Etching · Electrochemical machining · Functional integration; High costs · Laser drilling · Laser Induced Forward Transfer · Packaging technologies · Processing time · Pulse reverse plating · Through silicon vias · Through-Silicon-Via · Industrial Innovation · Mechatronics, Mechanics & Materials · EAM - Equipment for Additive Manufacturing TFT - Thin Film Technology · TS - Technical Sciences
[Abstract]

Search results also available in MS Excel format.

Showing 1 to 4 of 4 found. | Sort by date