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Prediction of the thermo-mechanical material behavior of PEN foil during photolithographic processing

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Author: Barink, M. · Goorhuis, M. · Giesen P. · Furthner, F. · Yakimets, I.
Type:article
Date:2009
Institution: TNO Industrie en Techniek
Source:2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009, 26 April 2009 through 29 April 2009, Delft
Identifier: 279984
doi: doi:10.1109/ESIME.2009.4938444
Article number: 4938444
Keywords: Bending behavior · Environmental factors · Flexible substrate · Lithographic process · Lithography process · Loading experiment · Organic materials · Plastic electronics · Thermo-mechanical · Thermomechanical model · Experiments · Lithography · Microelectronics · Microsystems · Plastic products · Simulators · Thermomechanical treatment · Substrates

Abstract

Flexible substrates (polymers) for plastic electronic products are far less stable to environmental factors, like heat and moisture, than currently used non-flexible substrates (silicon). This introduces problems during the lithography process of these products. This study presents a thermo-mechanical model of PEN foil; an organic material often used as flexible substrate for plastic electronics. The model is validated with experimental foil behavior during a loading experiment and with the experimental bending behavior in a foil on-carrier situation. These kind of models are useful as they can be used to predict and to optimize lithographic process steps. ©2009 IEEE.