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Thermo-mechanical challenges in the longevity of micro-electronics

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Author: Gielen, A.W.J.
Type:article
Date:2010
Institution: TNO Industrie en Techniek
Source:11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, 26-28 April 2010, Bordeaux, France
Identifier: 364416
ISBN: 9781424470266
Article number: No.: 5464507
Keywords: Electronics · Accelerated lifetime testing · Acceleration factors · Automotive electronics · Degradation mechanism · Lifetime assessment · Long duration · Mission profile · Operational conditions · Testing conditions · Thermo-mechanical · Automobile parts and equipment · Degradation · Microelectronics · Microsystems · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences

Abstract

Automotive electronics, solid-state-lighting, and solar cells need have to operate under harsh circumstances, either by the kind of environment they operate in, such as automotive electronics under the hood, or by the long durations of exposure. In both cases traditional lifetime assessment methods are failing: The accelaration factors, who are key to accelerated lifetime testing, are becoming to small as the operational conditions are nearing the testing conditions (automotive electronics under the hood) or are insuffiently large to obtain acceptable testing times (SSL and Solar). Trends and drivers for this are described . The some fundamental issues are presented for the mission profiles, failure and degradation mechanisms, as well as the acceleration factors. Ideas to overcome the presented limitations are shown in a combined testing-modelling scheme with some examples highlighting aspects of these ideas. ©2010IEEE.