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Electrostatic clamp manufactured by novel method

Author: Sligte, E. te · Storm, A. · Koster, N.B.
Type:article
Date:2011
Source:EUVL Symposium, Miami, Fl, USA, October 11-19, 2011
Identifier: 462703
Keywords: Electronics · Industrial Innovation · Physics & Electronics · NI - Nano Instrumentation · TS - Technical Sciences

Abstract

Electrostatic clamps (ESCs), used in reticle and wafer handling, are presently manufactured using glass bonding and polishing technologies. We present a patented alternative concept to this process, relying on coating and etching processes rather than bonding. We manufactured a first prototype clamp based on a silicon-on-insulator wafer. The clamping operation was demonstrated, and the clamp’s performance was characterized. Clamping force, coating quality, and achieved morphology are characterized and understood.