Electrostatic clamps (ESCs), used in reticle and wafer handling, are presently manufactured using glass bonding and polishing technologies. We present a patented alternative concept to this process, relying on coating and etching processes rather than bonding. We manufactured a first prototype clamp based on a silicon-on-insulator wafer. The clamping operation was demonstrated, and the clamp’s performance was characterized. Clamping force, coating quality, and achieved morphology are characterized and understood.