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Towards Quantitative Stiffness based Subsurface AFM

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Author: Piras, D. · Fillinger, L. · Rajadurai, S.R.S. · Es, M.H. van · Lans, M.J. van der
Type:report
Date:2019
Publisher: TNO
Place: Delft
Source:SID Semicon Innovation Day, Science Centre Delft, 21 May 2019
Identifier: 867667
Keywords: Quantitative stiffness based Subsurface AFM · ERP Early Research Program · 3D Nanomanufacturing Instruments · High Tech Systems & Materials · Industrial Innovation

Abstract

In order to make stiffness based subsurface AFM a quantitative imaging modality, the experimental subsurface measurement must be interpreted with a versatile forward (and inverse) model. We have developed a fully parametric finite element model framework for the quantification of critical dimensions relevant in semicon applications. After identification of the most relevant geometrical parameters, we have made a versatile tool to be used for the analysis and prediction of complex layouts that are relevant for the semiconductor industry. The framework is built and executed in the COMSOL Multiphysics/MATLAB interface.