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Overview on thermal and mechanical challenges of high power RF electronic packaging

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Author: Yuan, C.A. · Kregting, R. · Driel, W. van · Gielen, A.W.J. · Xiao, A. · Zhang, G.Q.
Type:article
Date:2011
Source:44th International Symposium on Microelectronics 2011, IMAPS 2011, 9-13 October 2011, Long Beach, CA, USA, 418-429
Identifier: 478225
ISBN: 9781618398505
Keywords: Electronics · Aluminum wires · Ceramic package · Plastic high power packages · RF power packages · Thermal and mechanical modeling · Aluminum wires · Ceramic package · High power package · Mechanical modeling · Rf-power · Electronics packaging · Integrated circuits · Microelectronics · Wireless telecommunication systems · Power electronics · Industrial Innovation · Mechatronics, Mechanics & Materials · MIP - Materials for Integrated Products · TS - Technical Sciences

Abstract

High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics requires a close co-development of digital-analog mixed circuit design, high power IC manufacturing technologies, and high power packaging design/process, in order to guarantee their performance and lifetime. In this paper, we overviewed our works on the packaging/assembly development of high power packages, including three parts: (1) Thermal simulation and die bond defect control (2) Mechanical integrity model for soft package heatsink implementation (3) Al wire multiphysics modeling and reliability of plastic power package.