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Contamination control: removing small particles from increasingly large wafers

Author: Jong, A.J. de · Donck, J.C.J. van der · Huijser, T. · Kievit, O. · Koops, R. · Koster, N.B. · Molkenboer, F.T. · Theulings, A.M.M.G.
Source:Metrology, Inspection, and Process Control for Microlithography XXVI, 13-16 February 2012, San Jose, CA, USA, 8324
Proceedings of SPIE - The International Society for Optical Engineering
Identifier: 460447
ISBN: 9780819489807
Article number: No.: 832423
Keywords: Chemistry · 450 mm wafers · Cleaning of molecular layers · High voltage cleaning · Particle cleaning · Plasma cleaning · Tacky rollers · Vacuum compatible cleaning · Industrial Innovation · Building Engineering & Civil Engineering Physics & Electronics · ECS - Energy & Comfort Systems NI - Nano Instrumentation · TS - Technical Sciences


With the introduction of 450 mm wafers, which are considerably larger than the currently largest wafers of 300mm, handling with side grippers is no longer possible and backside grippers are required. Backside gripping increases the possible buildup of particles on the backside of the wafers with possible cross-contamination to the front-side. Therefore, regular backside cleaning is required. Three vacuum compatible cleaning methods were selected. Tacky rollers and highvoltage cleaning were selected for particles and plasma cleaning for molecular layers. A test-bench was designed and constructed implementing these three cleaning methods. The first experiments show promising results for the plasma cleaner and the tacky roller. © 2012 SPIE.