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The EUV program at ASML: an update

Author: Meiling, H. · Banine, V. · Kürz, P. · Blum, B. · Heerens, G.J. · Harned, N.
Publisher: SPIE
Institution: TNO TPD
Source:Engelstad R.L., Emerging Lithography Technologies VII, 25-27 February 2003, Santa Clara, CA, USA, Conference code: 61519, 5037 I, 24-35
Proceedings of SPIE - The International Society for Optical Engineering
Identifier: 237291
Keywords: Electronics · Mirrors · Molybdenum compounds · Optics · Oxidation · Sensors · Ultraviolet radiation · Water · Extreme ultraviolet lithography · Particle detection system · Photolithography


With the realisation of the α-tool, ASML is progressing with the pre-commercialisation phase of its EUVL development. We report on the progress in the development of several key modules of the α-tool, including the source, wafer stage and reticle stage, wafer handling, baseframe, and optics modules. We demonstrate that the focus sensor meets its vacuum requirements, and that both stages after limited servo optimisation approach the required scanning performance. A particle detection system has been build for the qualification of the reticle handling module, and preliminary results show that 50nm particles can be detected. The optics lifetime program showed substantial progress by utilising caplayers to MoSi samples in order to suppress oxidation caused by H2O molecules under EUV illumination: a suppression ≥ 100× is achieved, compared to uncapped MoSi.