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Vertical interconnection of SOI photonic integrated circuits

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Author: Hagen, R. · Pozo Torres, J.M. · Kazmierczak, A. · Westerveld, W.J. · Harmsma, P.J. · Berg, J.H. van den · Schmits, R. · Yousefi, M. · Cabezon, M. · Villafranca, A. · Izquierdo, D. · Garces, J.I.
Type:article
Date:2011
Source:16th Annual Symposium of the IEEE Photonics Benelux Chapter, Gent, Belgium, 2011
Identifier: 446753
Keywords: Physics · Photonic integrated circuits · Silicon on insulator technology · SOI · Industrial Innovation · Physics & Electronics · NI - Nano Instrumentation · TS - Technical Sciences

Abstract

One of the important issues of System-on-a-package integration is the interconnection between independent Photonic Integrated Circuits (PICs). In this work, this issue is addressed by the use of Vertical Grating Couplers (VGCs) as the element for the interconnection between two Silicon-on-Insulator (SOI) PICs. Theoretical simulations using the finite-difference time-domain (FDTD) computational technique have shown that the coupling efficiency can be at least as good as 41%. In order to prove the principle, two SOI-PICs fabricated in ePIXfab have been stacked vertically via the foundry's standard VGCs.