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Optical and thermal simulation chain for LED package

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Author: Tapaninen, O. · Myohanen, P. · Majanen, M. · Sitomaniemi, A. · Olkkonen, J. · Hildenbrand, V. · Gielen, A.W.J. · Mackenzie, F.V. · Barink, M. · Smilauer, V. · Patzak, B.
Type:article
Date:2016
Publisher: Institute of Electrical and Electronics Engineers Inc.
Source:2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
Identifier: 537429
doi: doi:10.1109/EuroSimE.2016.7463349
ISBN: 9781509021062
Article number: 7463349
Keywords: Vision Electronics · Computer programming · Microelectronics · Microsystems · Open source software · Open systems · Comsol multiphysics · Multi-physics modelling · Open source platforms · Open sources · Optical simulation · Physical aspects · Python programming language · Thermal simulations · Computer software · Industrial Innovation · Nano Technology · MAS - Materials Solutions · TS - Technical Sciences

Abstract

This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.