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Low-cost packaging concepts for integrated nanophotonics

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Author: Rijnveld, N. · Neut, F.J.A. van der · Harmsma, P.J. · Lo Cascio, D.M.R. · Yousefi, M.
Place: Delft
Institution: TNO Industrie en Techniek
Source:Proceedings Symposium IEEE Photonics Benelux Chapter. Proc. 2010 Annual Symposium of the IEEE Photonics Society Benelux Chapter, Delft, The Netherlands, November 2010, 121-124
Identifier: 427941
Keywords: Physics · Physics & Electronics · NI - Nano Instrumentation · TS - Technical Sciences


Coupling an optical chip to its surroundings is very hard compared to an electrical chip. This complexity is mainly caused by alignment and accuracy challenges and is driving the cost price up to levels at which the commercial benefits of optical chips are no longer obvious, despite their many great technological advantages. Up to 80% of an optical system’s cost price consists of packaging, in which the coupling of chip to fiber is done on chip level instead of per wafer. We investigate reducing these packaging costs to make optical chips commercially more attractive.