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Comprehensive material characterization and method of its validation by means of FEM simulation

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Author: Gromala, P. · Duerr, J. · Dressler, M. · Jansen, K.M.B. · Hawryluk, M. · Vreugd, J. de
Source:2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18 April 2011 through 20 April 2011, Linz. Conference code: 85000, 1/8-8/8
Identifier: 430102
doi: doi:10.1109/ESIME.2011.5765770
ISBN: 9781457701078
Article number: 5765770
Keywords: Bi-material strips · Coefficient of thermal expansion · Copper substrates · Curing shrinkage · FEM simulations · Fringe pattern · Geometrical dimensions · Material characterizations · Material modeling · Material models · Modulus of elasticity · Molding compound · Numerical simulation · Warpages Engineering · Curing · Experiments · Finite element method · Microelectronics · Microsystems · Numerical methods · Product design · Shrinkage Engineering · Thermal expansion · Mechatronics, Mechanics & Materials · OM - Opto-Mechatronics · TS - Technical Sciences


Numerical simulation plays an important role in product design. Its accuracy relays on a detailed description of geometry, material models, load and boundary conditions. This paper focuses on a new approach of FEM material modeling of three commercially available molding compounds. Curing shrinkage, modulus of elasticity and coefficient of thermal expansion were measured and implemented into commercially available FEM code Ansys. Fringe pattern technique has been used to measure warpage of bimaterial strips. Then FEM simulation of bimaterial strips were done and compared with experimental results. Curing shrinkage has been modeled in an effective way. Its accuracy has been checked on one of the materials by creating bimaterial strips with three different geometrical dimensions, that is varied thickness of mold and copper substrate. © 2011 IEEE.