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Progress on EUV Pellicle development

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Author: Zoldesi, C.I. · Bal, K. · Blum, B. · Bock, G. · Brouns, D. · Dhalluin, F. · Dziomkina, N. · Arias Espinoza, J.D. · Hoogh, J. de · Houweling, S. · Jansen, M. · Kamali, M. · Kempa, A. · Kox, R. · Kruif, R. de · Lima, J. · Liu, Y. · Meijer, H. · Meiling, H. · Mil, I. van · Reijnen, M. · Scaccabarozzi, L. · Smith, D. · Verbrugge, B. · Winter, L. de · Xiong, X. · Zimmerman, J.
Publisher: SPIE
Source:Wood, O.R.Panning, E.M., Extreme Ultraviolet (EUV) Lithography V, 90481N-1 - 90481N-10
Identifier: 521417
doi: doi:10.1117/12.2049276
Article number: 90481N
Keywords: Nanotechnology · EUV · Pellicle · Reticle defect mitigation · EUV mask infrastructure · Physics & Electronics · NI - Nano Instrumentation · TS - Technical Sciences


As EUV approaches high volume manufacturing, reticle defectivity becomes an even more relevant topic for further investigation. Current baseline strategy for EUV defectivity management is to design, build and maintain a clean system without pellicle. In order to secure reticle front side particle adders to an acceptable level for high volume manufacturing, EUV pellicle is being actively investigated. Last year ASML reported on our initial EUV pellicle feasibility. In this paper, we will update on our progress since then. We will also provide an update to pellicle requirements published last year. Further, we present experimental results showing the viability and challenges of potential EUV pellicle materials, including, material properties, imaging capability, scalability and manufacturability. © (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE).