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Systems-in-foil: devices, fabrication processes and reliability issues

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Author: Brand, J. van den · Baets, J. de · Mol, A.M.B. van · Dietzel, A.H.
Type:article
Date:2008
Publisher: Elsevier
Place: Amsterdam
Institution: TNO Industrie en Techniek
Source:Microelectronics Reliability, 8-9, 48, 1123-1128
Identifier: 240935
Keywords: Elastic moduli · Optical design · Organic light emitting diodes (OLED) · Silicon · Thermal spraying · Water conservation · Fabrication processes · Organic light-emitting · Thermal expansion

Abstract

Systems-in-foil are a new class of electronics in which a full system is integrated into a flexible end product. In this paper, we discuss current research activities and state-of-the-art in this field. Furthermore, some of the associated and expected reliability issues will be addressed on the basis of three examples. As a first example we discuss a flexible large area polymeric organic light-emitting (OLED) device. The reliability targets of these devices require protection against the detrimental influence of water. As a second example, we describe a technology for embedding thinned Si chips between polymeric foils where a careful selection of the base materials is important to account for thermal expansion differences. Finally, as a third example, a novel technology for embedding conductive circuitry in a polymeric foil is discussed in which a good matching of the elastic moduli of the polymeric foil and the embedded circuitry is crucial for the flexibility robustness.