Stress in hard metal films

Stress in hard metal films

Janssen, G.C.A.M.
Kamminga, J.D.

Mechanical, Maritime and Materials Engineering

Materials Science and Engineering

2004-10-11

In the absence of thermal stress, tensile stress in hard metal films is caused by grain boundary shrinkage and compressive stress is caused by ion peening. It is shown that the two contributions are additive. Moreover tensile stress generated at the grain boundaries does not relax by ion bombardment. In polycrystalline hard metal films the grain structure evolves during growth, leading to wider grains higher up in the film. The tensile component of the stress in the film is generated at the grain boundaries and therefore depends on film thickness. The effect of ion bombardment is independent of grain size, therefore compressive stress does not depend on film thickness. As a result in polycrystalline films deposited under a bias voltage a stress gradient exists from tensile at the interface to compressive at the top of the film.

chromium
metallic thin films
ion-surface impact
grain boundaries
shot peening
grain growth
grain size
internal stresses
elastic constants

http://resolver.tudelft.nl/uuid:7fd80c42-9c43-41cf-b4ca-d99b4a95b534

https://doi.org/10.1063/1.1807016

American Institute of Physics

0003-6951

http://link.aip.org/link/APPLAB/v85/i15/p3086/s1

Applied Physics Letters, 85 (15), 2004

Institutional Repository

journal article

(c) 2004 The Author(s); American Institute of Physics