Print Email Facebook Twitter Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application Title Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application Author Hu, D. (TU Delft Electronic Components, Technology and Materials) Shah, M.B. (TU Delft Electrical Engineering, Mathematics and Computer Science) Fan, J. (TU Delft Electronic Components, Technology and Materials) Vollebregt, S. (TU Delft Electronic Components, Technology and Materials) Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials) Faculty Electrical Engineering, Mathematics and Computer Science Date 2023 Abstract Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size Cu paste sealing ring was achieved using a lithography patterned photoresist as a stencil mask. A groove-structured chip was used to amplify localized stress. The Cu nanoparticle paste was fully sintered at 300 °C under pressure ranging from 10 to 40 MPa resulting in a robust bonding with a maximum shear strength of 280 MPa and implementing hermetic packaging. The deflection of the Si diaphragms estimated a vacuum level of 7 kPa. Vacuum sealing was maintained for over six months, and the lowest leak rate was calculated as 8.4× 10 -13Pa·m 3/s. The developed technology that comprises small-size patterning and pressure-assisted sintering offers the potential for a simple, cost-effective, but robust solution for hermetic packaging. Subject BondingCu nanoparticlehermetic packagingleak ratePackagingPeriodic structurespressure-assisted sinteringResistsSiliconSinteringTemperature sensors To reference this document use: http://resolver.tudelft.nl/uuid:de1099de-e9d5-40fa-bef3-275e88b8afce DOI https://doi.org/10.1109/TED.2023.3312066 Embargo date 2024-03-25 ISSN 0018-9383 Source IEEE Transactions on Electron Devices, 70 (11), 5818 - 5823 Bibliographical note Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. Part of collection Institutional Repository Document type journal article Rights © 2023 D. Hu, M.B. Shah, J. Fan, S. Vollebregt, Kouchi Zhang Files PDF Copper_Nanoparticle_Sinte ... cation.pdf 10.28 MB Close viewer /islandora/object/uuid:de1099de-e9d5-40fa-bef3-275e88b8afce/datastream/OBJ/view