Title
High-Voltage and High-Current IGBT Press-pack Module for Power Grid
Author
Tan, C. (TU Delft Electronic Components, Technology and Materials; Southern University of Science and Technology) 
Wang, S. (TU Delft Bio-Electronics; Southern University of Science and Technology)
Liu, X. (TU Delft Electronic Components, Technology and Materials; Southern University of Science and Technology)
Jiang, Jing (Fudan University)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Ye, H. (TU Delft Electronic Components, Technology and Materials; Chongqing University)
Date
2022
Abstract
On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to solve the problem of chips failure caused by non-uniform rigid-contacting pressure in the press-pack modules, the elastic-contacting structure is designed to ensure excellent electrical connection between chips and contact terminal. During the operating conditions, the heat generated by IGBT chips can induce the increasing of internal temperature of the module, affecting the reliability of the module. A cooling structure is introduced between the subunits to solve the heat dissipation problem of the module. In addition, the thermal analysis of subunit and the cooling structure is performed by using the finite element simulation, and the chip layout and water-cooling scheme are optimized. The testing of electrical parameters of the IGBT module is also conducted.
To reference this document use:
http://resolver.tudelft.nl/uuid:f5f9693b-025e-49b7-b3ae-1d36b87f6f36
DOI
https://doi.org/10.1109/EuroSimE54907.2022.9758878
Publisher
IEEE
Embargo date
2023-07-01
ISBN
978-1-6654-5837-5
Source
Proceedings of the 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event
23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2022), 2022-04-25 → 2022-04-27, St Julian, Malta
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2022 C. Tan, S. Wang, X. Liu, Jing Jiang, Kouchi Zhang, H. Ye