Title
Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation
Author
Liu, Xu (Fudan University)
Hu, D. (TU Delft Electronic Components, Technology and Materials) 
Li, Z. (TU Delft Electronic Components, Technology and Materials)
Fan, Xuejun (Lamar University)
Zhang, Kouchi (TU Delft Electronic Components, Technology and Materials)
Fan, J. (TU Delft Electronic Components, Technology and Materials; Fudan University; Research Institute of Fudan University, Ningbo)
Date
2024
Abstract
The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures and initial porosities caused by different stacking patterns on the uniaxial tensile performance of the sintered layer were studied via a molecular dynamics approach. Two stacking patterns, simple cubic and face-centered cubic, were simulated, respectively. Evolution of their structure at temperatures of 300, 400, 500, and 600 K were simulated as the sintering process. Afterward, the sintered structures were subjected to uniaxial tensile with rates of 0.01 and 0.04 Å/ps at different temperatures to compare the mechanical properties. The results show that the sintering rate and density of the sintered structure increase with a higher temperature. However, the tensile strength of the sintered structure is less relevant to the difference in stacking pattern. This study proves that porosity has a greater effect on sintering quality.
Subject
Nano-copper sintering
molecular dynamics simulation
particle packing model
tensile simulation
To reference this document use:
http://resolver.tudelft.nl/uuid:4ce64f2f-2573-47a6-8f4d-e4bdbadea959
DOI
https://doi.org/10.1109/EuroSimE60745.2024.10491446
Publisher
IEEE
Embargo date
2024-10-09
ISBN
979-8-3503-9364-4
Source
Proceedings of the 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024-04-07 → 2024-04-10, Catania, Italy
Series
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2024 Xu Liu, D. Hu, Z. Li, Xuejun Fan, Kouchi Zhang, J. Fan