Title
Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation
Author
Li, Shizhen (Southern University of Science and Technology)
Jiang, Jing (Fudan University)
Liu, X. (TU Delft Electronic Components, Technology and Materials)
Wang, S. (TU Delft Bio-Electronics)
Zhang, Zhonghua (Harbin Medical University)
Ye, Huaiyu (Southern University of Science and Technology)
Date
2023
Abstract
Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and analyzed the related mechanism of interaction using experiments and molecular dynamics simulation. In the first session, we bonded dummy dies on various substrates, including bare Cu, and substrates with Ag or Au metallization by nanocopper pressure-assisted sintering. The mechanical properties of the bonding layers were estimated using shear strength and SEM image analysis of fracture and cross-section morphologies under different sintering conditions. We found that the group of Cu-bare Cu have better bonding strength as the sintering temperature or assisted pressure is not high enough. However, as more energy input to the bonding layer, such as higher temperature or larger sintering pressure, the mechanical performance showed a significant increase. In the second session, a sintering model, which contained a single nanoparticle and substrate, was built to illustrate the effects of metallization from the perspective of solid-state wetting. The contact angle was estimated using a creative method, and the crystallization structure evolutions under different sintering conditions were analyzed. We found that the lattice boundary generated as the Cu nanoparticle coalescence with Ag or Au substrate, which may decrease the bonding strength. However, for Ag and Au metallization, limited interface diffusion can be observed at the neck region, where a few numbers of substrate atoms transmitted toward Cu nanoparticle, and the contact area was larger than that of bare Cu substrate. Finally, a simple uniaxial stretching simulation was conducted to prove the results of sintering simulation. This study provides valuable insights into the effects of metallization on pressure-assisted nanocopper sintering, which can contribute to the optimization of mechanical properties of sintered nanoparticles in microelectronics applications.
Subject
Sintering
Nano Copper
Metallization
Molecular Dynamics
To reference this document use:
http://resolver.tudelft.nl/uuid:4da24bb0-23d3-44f6-acb2-e8884f6d49a9
DOI
https://doi.org/10.1109/ICEPT59018.2023.10492230
Publisher
IEEE
Embargo date
2024-10-11
ISBN
979-8-3503-3882-9
Source
Proceedings of the 2023 24th International Conference on Electronic Packaging Technology (ICEPT)
Event
2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023-08-08 → 2023-08-11, Shihezi City, China
Series
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
Bibliographical note
Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Part of collection
Institutional Repository
Document type
conference paper
Rights
© 2023 Shizhen Li, Jing Jiang, X. Liu, S. Wang, Zhonghua Zhang, Huaiyu Ye