Print Email Facebook Twitter Study on Reverse Recovery of a P-pillar Tunable Super-Junction MOSFET* Title Study on Reverse Recovery of a P-pillar Tunable Super-Junction MOSFET* Author Liu, Ke (Southern University of Science and Technology) Yuan, Wucheng (Southern University of Science and Technology) Wang, S. (TU Delft Bio-Electronics) Tan, C. (TU Delft Electronic Components, Technology and Materials) Ye, H. (TU Delft Electronic Components, Technology and Materials; Southern University of Science and Technology) Date 2022 Abstract In this paper, a novel bubble-shift super junction (SJ) MOSFET structure is proposed, and its main static electrical parameters and reverse recovery characteristics are simulated by TCAD software tool. By designing the P-pillar ion implantation windows with a certain offset, the bubble-shift SJ-MOSFET contains a curved pillar region in the upper half of the P-pillar. In the reverse recovery test of the proposed bubble-shift SJ-MOSFET, the peak reverse recovery current (I rrm ) is reduced from 16.04 A to 15.21 A, and the current drop rate (di/dt) is reduced from 1587 A/μs to 815 A/μs. Correspondingly, the proposed device achieves a better reverse recovery characteristic while sacrificing a small fraction of the drain-source breakdown voltage (BV) and drain-source special on-resistance (R on,sp ). Compared with the BV of 700 V and the R on,sp of 9 mΩ·cm 2 of the benchmark SJ-MOSFET. The proposed device has a BV of 650 V and a R on,sp of 12.4 mΩ·cm 2 . Mechanistically, the non-uniform depletion of the curved P-pillar reduces the carrier extraction rate, thereby prolonging the reverse current drop time (t f ) and increasing the softness factor (S) of the bubble-shift SJ-MOSFET. Subject super junctionreverse recoveryP-pillarbubbleshiftTCAD To reference this document use: http://resolver.tudelft.nl/uuid:5b98065c-8069-4933-8f9e-147edb367f80 DOI https://doi.org/10.1109/ICEPT56209.2022.9873376 Publisher IEEE Embargo date 2023-07-01 ISBN 978-1-6654-9906-4 Source Proceedings of the 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Event 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10 → 2022-08-13, Dalian, China Bibliographical note Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. Part of collection Institutional Repository Document type conference paper Rights © 2022 Ke Liu, Wucheng Yuan, S. Wang, C. Tan, H. Ye Files PDF Study_on_Reverse_Recovery ... MOSFET.pdf 2.02 MB Close viewer /islandora/object/uuid:5b98065c-8069-4933-8f9e-147edb367f80/datastream/OBJ/view