A novel method for nanoprecision alignment in wafer bonding applications

Title

A novel method for nanoprecision alignment in wafer bonding applications

Author

Jiang, L.
Pandraud, G.
French, P.J.
Spearing, S.M.
Kraft, M.

Faculty

Electrical Engineering, Mathematics and Computer Science

Date

2007

To reference this document use:

http://resolver.tudelft.nl/uuid:7fca3169-d27f-4e8e-bf91-7d2a45381283

Publisher

IOP

ISSN

0960-1317

Source

Journal of Micromechanics and Microengineering, 17 (7)

Part of collection

Institutional Repository

Document type

journal article

Rights

(c) 2007 Jiang, L.; Pandraud, G.; French, P.J.; Spearing, S.M.; Kraft, M.