Print Email Facebook Twitter Investigation on flip chip solder joint fatigue with cure-dependent underfill properties Title Investigation on flip chip solder joint fatigue with cure-dependent underfill properties Author Yang, D.G. Zhang, G.Q. Ernst, L.J. van 't Hof, C. Caers, J.F.J.M. Bressers, H.J.L. Janssen, J.H.J. Date 2003 To reference this document use: http://resolver.tudelft.nl/uuid:99943327-4858-44b2-9cbc-045c2f154c46 Publisher IEEE ISSN 1521-3331 Source IEEE Transactions on Components and Packaging Technologies, 26 (2) [see also IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies] Part of collection Institutional Repository Document type journal article Rights (c) 2003 Yang, D.G.; Zhang, G.Q.; Ernst, L.J.; Hof, Cv.; Caers, J.F.J.M.; Bressers, H.J.L.; Janssen, J.H.J. Files PDF ieee_yang_2003.pdf 2.11 MB Close viewer /islandora/object/uuid:99943327-4858-44b2-9cbc-045c2f154c46/datastream/OBJ/view