Print Email Facebook Twitter A new experimental approach to investigate the physics-of-failure of wirebond interconnects Title A new experimental approach to investigate the physics-of-failure of wirebond interconnects Author Kopally, Hima (TU Delft Electrical Engineering, Mathematics and Computer Science; TU Delft Microelectronics) Contributor van Driel, Willem (mentor) van Zeijl, Henk (graduation committee) Bossche, Andre (graduation committee) French, Paddy (graduation committee) Degree granting institution Delft University of Technology Programme Electrical Engineering Date 2018-08-21 Abstract Wirebonding is an interconnection technology used to connect a chip to its LED package. It is currently not well understood which wirebond characteristics are best to tailor to prevent the failure of wirebonds. The focus of this thesis is to understand the physics-of-failure of wirebonds via an experimental approach. Therefore, an experimental setup is designed which can accurately measure the resistance of the wirebond samples by four-wire resistance measurements. Furthermore, Finite Element simulations are done to understand the physical nature of wirebond failure better.Gold wirebonds with different loop geometries have been designed and made which are then subjected to temperature cycling. It is found through 4-wire experimental resistance setup that when a significant increase in resistance is reported, wirebond fatigue is imminent. Coffin-Manson based Finite Elementsimulations show that stresses at the neck are higher than at the heel. In retrospect, when the wirebond samples are encapsulated in Silicone, there is an increase in the stresses at the heel. Subject wire bondingphysics-of-failureinterconnectsfour wire resistance measurementfatigue To reference this document use: http://resolver.tudelft.nl/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a Part of collection Student theses Document type master thesis Rights © 2018 Hima Kopally Files PDF FINAL_Master_Thesis_Kopally.pdf 19.67 MB Close viewer /islandora/object/uuid:c562e0d9-7aff-428c-84d2-ad5c885b968a/datastream/OBJ/view