Towards a digital twin architecture for the lighting industry

This paper introduces an ontology-based Digital Twin (DT) architecture for the lighting industry, integrating simulation models, data analytics, and visualization to represent luminaires. The ontology standardizes luminaire components, facilitating interoperability with design tools. The calculated ontology-level metrics suggest mid-level...

ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components

Model order reduction techniques are developed and utilized to make numerical simulations more efficient. The use of Reduce Order Models (ROM) also enables data exchange with external parties without disclosing the sensitive information present in a Full-Order Model (FOM). It is crucial to optimize for both the efficiency and accuracy of a ROM...

Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin

Semiconductor devices are commonly encapsulated with Epoxy-based Moulding Compounds (EMC) to form an electronic package. EMC typically occupies a large volume within a package, and thus, governs its thermomechanical behaviour. When exposed to high temperatures (150°C and above), electronic packages predominantly show oxidation of the outer layer...

A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical...

Digital Twin-Based Hybrid PHM Framework for Monitoring Package-Level Degradation

Digital Twin can be broadly described as a continuously updated virtual representation of an object, system, or process which replicates all phases in the lifecycle of its physical counterpart. Originally conceptualized in 2003 [1], the term `Digital Twin' came into existence after it first appeared in NASA's roadmap in 2010 [2]. The concept...

EMC oxidation under high temperature aging

Epoxy molding compound (EMC) is widely used for encapsulating automotive electronics. Among all of the components of an electronic package, EMC is most exposed to the atmosphere, and thus undergoes aging. During high-temperature operation, EMC is oxidized, which alters its mechanical properties, and thus can affect the reliability of electronic...

Impact of Non-gravitational Forces on Magellan Orbit Determination: A Historic Mission To Venus

A detailed modeling of non-gravitational forces is an area that has been left unexplored in the past for orbit modeling of Magellan, primarily due to imperfect knowledge about its attitude and physical properties (optical properties and drag coefficient). As a result, past orbit analyses have restricted the non-gravitational force modeling by...