Carbon Nanotubes as Vertical Interconnects in 3D Integrated Circuits

Interconnects in integrated circuits (IC) are the major cause of power dissipation and delay. 3D integration has been proposed as a method to reduce these issues. For this 3D integration, fabrication of high aspect ratio reliable vertical interconnects (vias) are required. For this new materials, like carbon nanotubes (CNT), are being considered...