Searched for: faculty%3A%22Electrical%255C%252BEngineering%252C%255C%252BMathematics%255C%252Band%255C%252BComputer%255C%252BScience%22
(1 - 9 of 9)
- document
-
Lawand, N.S. (author), Lopez, V. (author), French, P.J. (author)Cochlear implants (CIs) are commonly accepted therapeutic devices for clinical use and have restored hearing to more than 230,000 profoundly deaf people. CI devices consists of an external part comprising a speech processor (DSP) a microphone which together receive and convert the sound into a digital data stream using a speech processing...conference paper 2013
- document
- Purniawan, A. (author), Pandraud, G. (author), Vakalopoulos, K.A. (author), French, P.J. (author), Sarro, P.M. (author) conference paper 2012
- document
-
Rajaraman, V. (author), Pakula, L.S. (author), Pham, H.T.M. (author), Sarro, P.M. (author), French, P.J. (author)This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide variety of surface- and thin-SOI...conference paper 2009
- document
-
Pakula, L.S. (author), Rajaraman, V. (author), French, P.J. (author)The operation principle, design, fabrication and measurement results of a quasi digital accelerometer fabricated on a thin silicon-on-insulator (SOI) substrate is presented. The accelerometer features quasi-digital output, therefore eliminating the need for analogue signal conditioning. The accelerometer can be directly interfaced to digital...conference paper 2009
- document
-
Rajaraman, V. (author), Makinwa, K.A.A. (author), French, P.J. (author)We present a simple, flexible and low cost MEMS fabrication process, developed using deep reactive ion etching (DRIE) and wafer bonding technologies, for manufacturing in-plane high aspect ratio (HAR) inertial sensors. Among examples, the design and fabrication results of a two axis inertial device are presented. Fabricated device thickness...conference paper 2008
- document
-
Margallo-Balbas, E. (author), Pandraud, G. (author), French, P.J. (author)Optical Coherence Tomography (OCT) is a powerful medical imaging technology. Its ability to non-invasively probe tissues in depth with high resolution has lead to applications in many fields of medicine, with a large potential for surgical guidance. One of the technological challenges impairing faster adoption of OCT is the relative complexity...conference paper 2007
- document
- Pakula, L. (author), French, P. (author) conference paper 2007
- document
-
Wicaksono, D.H.B. (author), Pandraud, G. (author), French, P.J. (author)This paper presents an on-going work to develop micromachined silicon-based strain sensor inspired from the campaniform sensillum of insects. We present simple optical setup for the characterisation of a membrane-in-recess structure as an early stage in mimicking the natural sensor. The microstructure is a 500 nm-thick SiO2/SiN circular membrane...conference paper 2005
- document
-
Pandraud, G. (author), Pham, H.T.M. (author), Pakula, L.S. (author), Sarro, P.M. (author), French, P.J. (author)Planar silicon carbide (SiC) waveguides are proposed for fabrication on a silicon substrate with a oxide isolation layer. Using post deposition annealing it is possible to achieve low Polarization-Dependent Loss (PDL) within optical SiC waveguides fabricated using a low temperature deposition technique. Those waveguides have been successfully...conference paper 2005
Searched for: faculty%3A%22Electrical%255C%252BEngineering%252C%255C%252BMathematics%255C%252Band%255C%252BComputer%255C%252BScience%22
(1 - 9 of 9)