Coupling model of electromigration and experimental verification – Part II: Impact of thermomigration

This paper presented a comprehensive experimental and simulation study for thermomigration (TM) accompanying electromigration (EM) at elevated current densities. Both Blech and standard wafer-level electromigration acceleration test (SWEAT)-like test structures, with aluminum (Al) as a carrier, were used for testing and analysis. In Part I of...

Multi-Physics Driven Electromigration Study: Multi-Scale Modeling and Experiment

This dissertation presents a comprehensive and integrated study, including theory development, numerical simulation and experiment, for multi-physics driven electromigration in microelectronics. Multi-scale methodologies from atomistic modeling to continuum theory-based simulation have been developed. Moreover, extensive experimental testing,...