Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

As the next generation of semiconductor devices, SiC MOSFETs have demonstrated significant performance improvements in switching loss, switching frequency, and high-temperature operation compared to Si-based MOSFETs. However, the long-term reliability of such devices and their packaging continues to be a major concern. Towards addressing this...

Data Compression versus Signal Fidelity Trade-off in Wired-OR ADC Arrays for Neural Recording

This paper investigates the efficacy of a wired-OR compressive readout architecture for neural recording, which enables simultaneous data compression of action potential signals for high channel count electrode arrays. We consider a range of wiring configurations to assess the trade-offs between compression ratio and various task-specific signal...

Study on route division for ship energy efficiency optimization based on big environment data

In the case of the global energy crisis and the higher sound of energy saving and emission reduction, how to take effective management measures of ship energy efficiency to achieve the goal of energy saving and emission reduction, put forward a new challenge for the development of shipping technology. The application of big data technology...

Line planning problem in a dense High-Speed Rail corridor

To satisfy the growing passenger transportation demands and improve the service quality in a railway system, a high-quality line plan needs to be designed. Line planning is an initial optimization problem in the process of railway transportation management, which includes the origin and destination (OD) of trains, routes, stop patterns and...