Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm

As the next generation of semiconductor devices, SiC MOSFETs have demonstrated significant performance improvements in switching loss, switching frequency, and high-temperature operation compared to Si-based MOSFETs. However, the long-term reliability of such devices and their packaging continues to be a major concern. Towards addressing this...

Efficient MSPSO Sampling for Object Detection and 6D Pose Estimation in 3D Scenes

The point pair feature (PPF) is widely used in industrial applications for estimating 6D poses of known objects from unrecognized point clouds. The key to the success of PPF matching is to establish correct 3D correspondences between the object and the scene, i.e., finding as many valid similar point pairs as possible. Thus, a set of...

Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer

Based on molecular dynamics (MD), in this study, a model was established to simulate the initial coating morphology of silver paste by using a random algorithm, and the effects of different sizes of particles on sintering porosity were also analyzed. The MD result reveals that compared with the sintering process using large-scale silver...