Exact derivation of the geometric correction factor of the center notched test specimen, based on small cracks merging as explanation of softening

The exact derivation of the mode I geometric correction factor is given, based on the small crack merging mechanism to show that this always is the real fracture mechanism in wood. This mechanism dominates at late softening and explains fully the apparent decrease of the energy release rate of macrocrack extension as already known for mode I and...

Failure and Delamination in Microelectronic Packages

Thin layers of dissimilar materials are used in most microelectronic components in order to achieve special functional requirements. Generally, the interface between two adjacent materials forms a weak link, not only because of the relatively low delamination strength, but also because of the existing mismatch in thermo-mechanical properties,...

Reliability at the Chip Interfaces: Delaminating the Silicon Die from Molding Compound

This book describes a setup that allows to delaminate the Silicon-to-Molding Compound interface for obtaining interfacial fracture parameters: the Mixed Mode Chisel setup (MMC). With this device for the first time the delamination can be initiated and propagated, while preventing the occurrence of random brittle fracture in one or both of the...