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Collection: research
(1 - 20 of 33)
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Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling
Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
Insights into sulfur and hydrogen sulfide induced corrosion of sintered nanocopper paste: A combined experimental and ab initio study
Reliability improvement of the dredging perception system: A sensor fault-tolerant strategy
Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation
Effects of GBFS content and curing methods on the working performance and microstructure of ternary geopolymers based on high-content steel slag
Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules
Assessment of Vigilance Level during Work: Fitting a Hidden Markov Model to Heart Rate Variability
A 155W −95.6 dB THD+N GaN-based Class-D Audio Amplifier With LC Filter Nonlinearity Compensation
Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore
Thermal-mechanical-electrical Co-design of Fan-Out Panel-Level SiC MOSFET Packaging with a Multi-objective Optimization Algorithm
Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation
Sulfur-Rich Ageing Mechanism of Silicone Encapsulant Used in LED Packaging: An Experimental and Molecular Dynamic Simulation Study
Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging
Plot-level reconstruction of 3D tree models for aboveground biomass estimation
Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition
Luminous performances characterization of YAG: Ce3+ phosphor/silicone composites using both reflective and transmissive laser excitations
基于Lambert-Beer理论与人工神经网络的混合荧光粉发射光谱预测
Collection: research
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