Thin Film Interface Fracture Properties at Scales Relevant to Microelectronics

Conference paper (2007)
Faculty
Mechanical Maritime and Materials Engineering (Mechanical Maritime and Materials Engineering) (TU Delft)
Copyright: © 2007 Xiao, A.; Wang, L.G.; Van Driel, W.D.; Van Der Sluis, O.; Yang, D.G.; Ernst, L.J.; Zhang, G.Q.
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Published Date

2007

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Source:

proceedings of the International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, London, April 15-18, 2007

ISBN:

1-4244-1106-8

Faculty

Mechanical Maritime and Materials Engineering

Files

2007-35.pdf
(pdf | 5.41 Mb)