J

JP Lokker

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20 records found

Mechanical and structural properties of aluminium alloy thin films for microelectronic applications
Doctoral thesis - JP Lokker

Influence of the passivation material on Stress voiding in AI-Cu alloys.
Journal article - JP Lokker, G.C.A.M. Janssen, S Radelaar

Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.

Phase transformations in Al-Cu thin films: Precipitation and copper redistribution.

Isothermal stress relaxation in Al, AlCu and AlVPd films

Aluminium via fill at elevated pressure and teperature

High Pressure Filling of Sub-micron Aluminium Vias

Comparison of electromigration and stress-voiding properties of submicron Al-Cu (1 at% Cu) and AlNiCr (0.1 at% Ni, o.1 at%Cr) interconnect lines

Report on mechanical and electrical reliability of AlNiCr

Stress voiding in passivated Al-Cu alloys

Report on stress relaxation at constant temperatures in AlNiCr contiguous films and stacks of films

Report on electromigration- and stress migration properties of AlSi VPd alloys

Cu concentration dependence of the mechanical behaviour of Al-Cu alloys.

Mechanical Reliability of CVD-Copper Thin Films

Anomalous behaviour of stress in AlCu alloys

Aluminium Sub-micron Via-Fill using a high Pressure Liquid Transducer

Copper for IC-applications. Mechanical reliability of CVD copper films

In-situ characterization of precipation in Al-Cu thin films.

Isothermal stress relaxation in Al, AlCu and AlVPd films

Stress in AlNiCr films and stacks of films