Mechanical and structural properties of aluminium alloy thin films for microelectronic applications

Phase transformations in Al-Cu thin films: Precipitation and copper redistribution.

Influence of the passivation material on Stress voiding in AI-Cu alloys.

Localized stress near and the thermal expansion of AI 2 Cu precipitates in an AI thin film matrix.

Cu concentration dependence of the mechanical behaviour of Al-Cu alloys.

In-situ characterization of precipation in Al-Cu thin films.

Characterization of precipitation in Al-Cu thin films by DSC and X-ray diffraction analysis.

Aluminium via fill at elevated pressure and teperature

Comparison of electromigration and stress-voiding properties of submicron Al-Cu (1 at% Cu) and AlNiCr (0.1 at% Ni, o.1 at%Cr) interconnect lines

High Pressure Filling of Sub-micron Aluminium Vias

Stress voiding in passivated Al-Cu alloys

Mechanical behaviour during thermal cycling of AIVPd line patterns

Stress in AlNiCr films and stacks of films

High Pressure Aluminium for Submicron Vias using a Liquid Transducer

High Pressure Aluminium Via-Fill for ULSI interconnect using a Liquid Transducer

Report on stress relaxation at constant temperatures in AlNiCr contiguous films and stacks of films

Mechanical Reliability of CVD-Copper Thin Films

Report on mechanical and electrical reliability of AlNiCr

Aluminium Sub-micron Via-Fill using a high Pressure Liquid Transducer

Copper for IC-applications. Mechanical reliability of CVD copper films