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Journal article (1)

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Polymer interconnections for 3D-chip stacking technology: directional volume patterning of flexible substrates with conducting polymer wires

Journal article (2004) - C Videlot (author) , J Ackermann (author) , F Fages (author) , NT Nguyen (author) , L Wang (author) , Pasqualina M Sarro (author) , D Crawly (author) , K Nikolic (author) , M Forshaw (author)