Research in engineering ethics has examined the effects of education on the ethical knowledge and reasoning of students from mostly WEIRD (Western educated industrialized rich democratic) cultures. However, it is unclear that findings from WEIRD samples are transferable across cultures. China now graduates and employs more STEM (science technology engineering mathematics) majors than any other country, although little work has examined the ethical perspectives and education of these students. Therefore, a study was conducted exploring the kinds of ethical issues Chinese engineering students expect to encounter (expectations), the importance they attach to being ethical (motivations), and their relations to various curricular and extra-curricular factors, including sources of ethical influence, nature and extent of ethics education, and perceived usefulness of ethics education. 163 Chinese engineering majors from two Chinese-foreign educational institutes in Shanghai, China completed a survey. Results indicate participants were most likely to expect to face ethical issues related to fairness, and that the perceived usefulness of ethics education was predictive of both ethical expectations and motivations, followed by encountering instructors who cared about ethics. The extent of ethics education was related to ethical expectations but not motivations. The implications of these findings and directions for future work are discussed.

Au-Cu bimetallic thin films with controlled composition were fabricated by magnetron sputtering co-deposition, and their performance for the electrocatalytic reduction of CO ₂ was investigated. The uniform planar morphology served as a platform to evaluate the electronic effect isolated from morphological effects while minimizing geometric contributions. The catalytic selectivity and activity of Au-Cu alloys was found to be correlated with the variation of electronic structure that was varied with tunable composition. Notably, the d-band center gradually shifted away from the Fermi level with increasing Au atomic ratio, leading to a weakened binding energy ofCO, which is consistent with low CO coverage observed in CO stripping experiments. The decrease in theCO binding strength results in the enhanced catalytic activity for CO formation with the increase in Au content. In addition, it was observed that copper oxide/hydroxide species are less stable on Au-Cu surfaces compared to those on the pure Cu surface, where the surface oxophilicity could be critical to tuning the binding strength ofOCHO. These results imply that the altered electronic structure could explain the decreased formation of HCOO ^- on the Au-Cu alloys. In general, the formation of CO and HCOO ^- as main CO ₂ reduction products on planar Au-Cu alloys followed the shift of the d-band center, which indicates that the electronic effect is the major governing factor for the electrocatalytic activity of CO ₂ reduction on Au-Cu bimetallic thin films.