RS

R Shi

6 records found

Pattern shift is one of the main failures of micro-electronics. In this paper, the influence of plastic deformation values of micro-structures of IC packages on the pattern shift of metal lines is studied by maximum plastic strain theory using a certain 2D FEM model with differen ...
Passivation cracking is one of the main failures of Integrated Circuits (ICs) and thermo-mechanical failures are the root cause. A major cause for these failures is due to the mismatch of thermal and mechanical parameters while manufacturing or working, especially stress concentr ...
The passivation cracking of Micro-structures of IC packages is studied by maximum principal stress theory using a certain 2D FEM model with different design parameters, pitch of lines, width of line, thickness of epoxy, thickness of dielectric layer, thickness of glue, the glue m ...