3D stacking is an emerging technology promising many benefits such as low latency between stacked dies, reduced power consumption, high bandwidth communication, improved form factor and package volume density, heterogeneous integration, and low-cost manufacturing. However, it requires modification of existing methods and/or introduction of new ones with respect to design, manufacturing, and testing in order to facilitate production. In this thesis three challenges are addressed: one related to manufacturing (i.e., yield improvement) and two related to testing (i.e., cost modeling and interconnect testing). Yield improvement - We propose two yield improvement schemes applicable for 3D Stacked-ICs (3D-SICs) with similar die sizes (such as memories and FPGAs): wafer matching and layer redundancy. Wafer matching is based on algorithms that select wafers with identical or similar fault maps for stacking to boost the compound yield. Our algorithms outperform yield-wise previously proposed schemes, and more importantly reduce memory and time complexity significantly. On the other hand, redundancy in 3D memories makes use not only of conventional spare rows and columns, but also of the third dimension to access either spare dies (layer redundancy) or spare cells (inter-layer redundancy). Layer redundancy showed to be effective from a yield point of view, but may seriously affect die area and cost. Inter-layer redundancy realizes even higher yield improvements; however, it requires through-silicon vias (TSVs) to scale down with one order of magnitude for area-efficient implementations. Cost Modeling - Selecting an appropriate and efficient test flow for 2.5D/3D SICs is crucial for overall cost optimization. In addition, diverse products and applications require different quality levels resulting in different test flows; these flows may require different design-for-test (DfT) features, which need to be incorporated in the various dies during an early design stage. Therefore, an appropriate cost model used to evaluate test flows with their associated DfT, while taking into account yields and die production costs, is of great importance. A proper cost modeling tool for 2.5D/3D stacked ICs is developed; the tool is referred to as 3D-COSTAR. It considers all costs involved in the whole production chain, including design, manufacturing, test, packaging, and logistics, e.g., related to shipping wafers between a foundry and a test house. 3D-COSTAR provides the estimated overall cost for 2.5D/3D-SICs and its cost breakdown for a given input parameter set, such as test flows, die yield, stack yield etc. The crucial importance of 3D-COSTAR is demonstrated by analyzing trade-offs of different complex optimization test problems such as (a) the impact of test coverage of the pre-bond silicon interposer test, (b) the impact of pre-bond testing of active dies using either dedicated probe-pads or micro-bumps, (c) the impact of mid-bond testing and logistics, and (d) the impact of different test flows on the test escapes. Interconnect Testing - A potential application of 3D-SICs is stacking of memory on logic. However, testing the TSV interconnects between such dies is challenging, as the memory and the logic die typically come from different manufacturers. Currently, proposed solutions fail to address dynamic and time-critical faults. In addition, memory vendors have in the past not been in favor to put additional DfT structures such as IEEE 1149.1 for interconnect testing on their memory devices. We propose a new Memory-Based Interconnect Test (MBIT) approach for 3D stacked memories. Our test patterns are applied by using read and write instructions to the memory and are validated by a case study where a 3D memory is assumed to be stacked on a MIPS64 processor. The main benefits of the MBIT approach include zero area overhead, detection of both static and dynamic faults, at-speed testing, flexibility, extremely short test time, and interconnect fault diagnosis.